PAI SnAg0.3Cu0.7+Ni+Ge RoHS compliance solder wires are being formulated with high virgin
raw metals processed in state-of-the-art Vaccualloy Technology that brings world class quality
along. Here, oxygen interaction with alloy is nil and thus, dross formulation is reduced at PCB
assembly process. Also an increased flow rate & reduced impurities found. PAI
SnAg0.3Cu0.7+Ni+Ge alloy are compatible for a typical range of flux application formulas used in
Electronics Industry today.
Download – Technical Data Sheet
