PAI SH6209-4 (Sn62.8Ag0.4Pb36.8) RMA NC Solder Paste

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SH-6209-4

PAI tin/lead/silver no-clean solder pastes are made from a special formulation of highest purity ingredients to ensure the process consistency of today’s demanding ultra-fine-pitch challenges. Our formulation offers a wide processing window and excellent shelf life, with full wetting and clean-ability features to prolong stencil life.

SH-6209-4  is a Sn62.8 / Pb36.8 / Ag0.4 alloy with Type 3 & Type 4  and no-clean ROL0 flux. It comes packaged in a 500-gram & 250-grams jar.

  • High print speed (0-120 mm/sec)
  • Excellent wettability
  • Reflow with or without nitrogen
  • Low void
  • Over 8 hours stencil life
  • Extended tack time > 12 hours

Download – Technical Data Sheet

 

SKU: SH6209-4 Category:

Description

Specification
Item Specification Standard
Appearance Gray paste, No foreign, No Stiff
Alloy composition Sn62.8 / Pb36.8 / Ag0.4 JIS-Z-3282
Melting Point 179~189°C
Particle Size (Type 3) +45μm < 1%, —20μm < 10%
(Type 4) +38μm < 1%, —20μm < 10%
IPC-TM-650,2.2.14
Powder Shape Spherical
Flux Content 10 ± 1.0wt% JIS-Z-3197, 8.1.2
Viscosity 200 ± 30 Pa s (25±1 C°, 10rpm,Malcom ) JIS-Z-3284, Annex 6
Flux Type ROL0 J-STD-004
Test Content
Test Item
Test Result
Test Method
Copper Plate Corrosion Test Pass JIS-Z-3197, 8.4.1
Spread Test > 75% JIS-Z-3197, 8.3.1.1
Copper Mirror Test Pass IPC-TM-650, 2.3.32
Viscosity Test(25 °C,10rpm) 200 ± 30 Pa • s JIS-Z-3284. Annex 6
Tackiness Test (gf) > 120 up (8hr)) JIS-Z-3284. Annex 9
Slump Test Less than 0.3 mm JIS-Z-3284. Annex 7, 8
Solder Ball Test Pass JIS-Z-3284. Annex 11
Reliability Test
S.I.R. Test ◊ > 1×109 Ω , Pass IPC-TM-650, 2.6.3.3
Electro Migration Test ♦ 1×1012 up Pass IPC-TM-650, 2.6.14.1
◊ Test Conditions: 85 °C, 85% RH for 168 hrs ♦Test Conditions: 65 °C, 85% RH for 596 hrs
Alloy Composition
(Sn) (Pb) (Ag)  (Cu) (Zn) (Al) (Sb) (Fe) (As) (Bi) (Cd)
62.8
±1.0
REM. 0.4
±0.05
0.05
MAX
0.002MAX 0.002MAX 0.12MAX 0.02MAX 0.03MAX 0.10MAX 0.002MAX
Patent No. • Japanese Patent No. 3296289 • U.S Patent No. 6179935B1. Germany Patent No. 19816671C2 (Wt%)

Temperature Profile

1、  Ramp @ 1.5~2.5°C/Sec to 120~170°C

2、  Dwell @ 120~170°C for 60~100 sec

3、  Ramp @ 1~2°C/sec to 210~220°C peak temperature over 200°C for 30~60 sec

4、  Ramp down to room temperature @ 1~4°C/sec

 

Handling and Storage Instruction

  1. Storage

(1)    Keep in 0~10°C temperature.

(2)    Expiration period: 6 months from production date. 7 days storage in (25 ± 2°C) (sealed condition)

(3)    Keep out of direct sunlight.

  1. Operation Manual (Sealed)

(1)    Keep solder paste in room temperature (25 ± 2°C) for 3~4 hours. Do not use any heater to raise temperature.

(2)    Kindly mixed averagely for 1~3 minutes according to necessity.

  1. Operation Manual (Opened)

(1)    At first, add 2/3 can of solder paste onto the stencil, do not add more than 1 can of each.

(2)    Add solder paste a little at a time according to production procedure.

(3)    To maintain the solder paste quality, please make sure not to store the opened can with sealed can.

(4)    Use new opened solder paste at the beginning of the next day. Mix opened solder paste with sealed one at ratio 1:2, add little at a time during printing.

(5)    Soon after printing, please make sure all components to be mount on printed circuit board between 4~6 hours.

(6)    Please withdraw solder paste from stencil and seal it in paste container, if printing process would pause for more than 1 hour.

(7)    After continuously printing for 24 hours, kindly withdraw printed solder paste and follow step (4).

(8)    It is recommended to clean both side of stencil every 4 hours manually to ensure printing quality.

(9)    Kindly keep room temperature between 22~28°C, room humidity RH 30~60% is recommended.

(10)  To clean up the defect printed board, kindly use isopropyl alcohol or IPA.

Additional information

Weight N/A
Weight

250 gm, 500 gm

Select Type

Type 3, Type 4

Title

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