Description
Specification—
| Item |
Specification |
Standard |
| Appearance |
Gray paste, No foreign, No Stiff |
|
| Alloy composition |
Sn62 / Ag2 / Pb36 |
JIS-Z-3282 |
| Melting Point |
179~189°C |
|
| Particle Size |
(Type 3) +45μm < 1%, —20μm < 10%
(Type 4) +38μm < 1%, —20μm < 10% |
IPC-TM-650,2.2.14 |
| Powder Shape |
Spherical |
|
| Flux Content |
10 ± 1.0wt% |
JIS-Z-3197, 8.1.2 |
| Viscosity |
200 ± 30 Pa s (25±1 C°, 10rpm,Malcom ) |
JIS-Z-3284, Annex 6 |
| Flux Type |
ROL0 |
J-STD-004 |
—Test Content—
Test Item
|
Test Result
|
Test Method |
| Copper Plate Corrosion Test |
Pass |
JIS-Z-3197, 8.4.1 |
| Spread Test |
> 75% |
JIS-Z-3197, 8.3.1.1 |
| Copper Mirror Test |
Pass |
IPC-TM-650, 2.3.32 |
| Viscosity Test(25 °C,10rpm) |
200 ± 30 Pa • s |
JIS-Z-3284. Annex 6 |
| Tackiness Test (gf) |
> 120 up (8hr)) |
JIS-Z-3284. Annex 9 |
| Slump Test |
Less than 0.3 mm |
JIS-Z-3284. Annex 7, 8 |
| Solder Ball Test |
Pass |
JIS-Z-3284. Annex 11 |
—Reliability Test—
| S.I.R. Test ◊ |
> 1×109 Ω , Pass |
IPC-TM-650, 2.6.3.3 |
| Electro Migration Test ♦ |
1×1012 up Pass |
IPC-TM-650, 2.6.14.1 |
◊ Test Conditions: 85 °C, 85% RH for 168 hrs ♦Test Conditions: 65 °C, 85% RH for 596 hrs
—Alloy Composition—
| (Sn) |
(Pb) |
(Ag) |
(Cu) |
|
(Zn) |
(Al) |
(Sb) |
(Fe) |
(As) |
(Bi) |
(Cd) |
|
| 62.0±1.0 |
REM. |
2.0±0.3 |
0.05MAX |
|
0.002MAX |
0.002MAX |
0.12MAX |
0.02MAX |
0.03MAX |
0.10MAX |
0.002MAX |
|
Patent No. • Japanese Patent No. 3296289 • U.S Patent No. 6179935B1. Germany Patent No. 19816671C2 (Wt%)
1、 Ramp @ 1.5~2.5°C/Sec to 120~170°C
2、 Dwell @ 120~170°C for 60~100 sec
3、 Ramp @ 1~2°C/sec to 210~220°C peak temperature over 200°C for 30~60 sec
4、 Ramp down to room temperature @ 1~4°C/sec
Handling and Storage Instruction
- Storage
(1) Keep in 0~10°C temperature.
(2) Expiration period: 6 months from production date. 7 days storage in (25 ± 2°C) (sealed condition)
(3) Keep out of direct sunlight.
- Operation Manual (Sealed)
(1) Keep solder paste in room temperature (25 ± 2°C) for 3~4 hours. Do not use any heater to raise temperature.
(2) Kindly mixed averagely for 1~3 minutes according to necessity.
- Operation Manual (Opened)
(1) At first, add 2/3 can of solder paste onto the stencil, do not add more than 1 can of each.
(2) Add solder paste a little at a time according to production procedure.
(3) To maintain the solder paste quality, please make sure not to store the opened can with sealed can.
(4) Use new opened solder paste at the beginning of the next day. Mix opened solder paste with sealed one at ratio 1:2, add little at a time during printing.
(5) Soon after printing, please make sure all components to be mount on printed circuit board between 4~6 hours.
(6) Please withdraw solder paste from stencil and seal it in paste container, if printing process would pause for more than 1 hour.
(7) After continuously printing for 24 hours, kindly withdraw printed solder paste and follow step (4).
(8) It is recommended to clean both side of stencil every 4 hours manually to ensure printing quality.
(9) Kindly keep room temperature between 22~28°C, room humidity RH 30~60% is recommended.
(10) To clean up the defect printed board, kindly use isopropyl alcohol or IPA.
