High purity Alloy that is composed of 63% Tin and 37% Lead from Virgin Metals. Applies at Hand or Feed Soldering Process in Electronic & Electrical Assemblies. Non-Corrosive and No Impact of Residues form at Post Soldering which means of passes in Pin Probe & Flying Probe Tests for No Clean Wires. If requires, Residues shall clean with appropriate Liquid Application. Précised amount of Flux cored from state-of the-art-Technology Process.

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