High purity alloy that is composed of 60% Tin and 40% Lead from virgin metals. Applies at hand or feed soldering processes in Electronics & Electrical assemblies. Non-corrosive and no impact of flux residues forming at post soldering which means of passing in pin probe & flying probe tests for No Clean solder wires. If required, flux residues shall be cleaned with appropriate liquid application. Précised amount of flux cored from state-of the-art-technology manufacturing process.
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