Name: PAI PF610 (SAC305+Ni+Ge) NC Solder Paste
SKU: PF610
Availability: OutOfStock

PART NO: PF610

The higher processing temperatures required for lead-free soldering make unprecedented demands on solder pastes. In addition to consistent printing and reflow requirements, there is a need for higher repeatability in high mix, high-yield lines. All these and other Pb-free challenges are met with consistency in SMTSolderPaste.com’s lead-free pastes. Processable by air or nitrogen reflow, they offer the advantages of excellent wetting characteristics and long shelf life.

PF610 is an Sn/Ag3.0/Cu0.5/Ni+Ge alloy with Type 3 & Type 4 and no-clean ROL0 flux. It comes packaged in a 500-gram & 250-grams jar.

Pb < 1000 ppm, Cd < 20 ppm
High print speed: 0-120 mm/sec
Over 8 hours stencil life
Extended tack time > 12 hours
Excellent wettability
Low void

Download – Technical Data Sheet

Description

–Specification—

Item	Specification	Standard
Appearance	Gray paste w/o visible foreign matter and clusters
Alloy composition	Sn/Ag3.0/Cu0.5/Ni0.06/Ge0.01	JIS-Z-3282
Melting Point	217-219 °C
Particle Size	(Type 3) +45μm < 1%, —20μm < 10% (Type 4) +38μm < 1%, —20μm < 10% (Type 5) +25μm < 1%, —15μm < 10% (Type 6) +15μm < 1%, —5μm < 10%	IPC-TM-650,2.2.14
Powder Shape	Spherical
Flux Content	11 ± 1.0wt%	JIS-Z-3197, 8.1.2
Viscosity	200 ± 30 Pa s (25±1 C°, 10rpm,Malcom )	JIS-Z-3284, Annex 6
Flux Type	ROL0	J-STD-004

—Test Content—

Test Item	Test Result	Test Method
Copper Plate Corrosion Test	Pass	JIS-Z-3197, 8.4.1
Spread Test	> 75%	JIS-Z-3197, 8.3.1.1
Copper Mirror Test	Pass	IPC-TM-650, 2.3.32
Viscosity Test(25 °C,10rpm)	200 ± 30 Pa • s	JIS-Z-3284. Annex 6
Tackiness Test (gf)	> 140 up (8hr)	JIS-Z-3284. Annex 9
Slump Test	Pass	JIS-Z-3284. Annex 7, 8
Solder Ball Test	Pass	JIS-Z-3284. Annex 11

—Reliability Test—

S.I.R. Test ◊	> 1×10⁹ Ω , Pass	IPC-TM-650, 2.6.3.3
Electro Migration Test ♦	Pass	IPC-TM-650, 2.6.14.1

◊ Test Conditions: 85 °C, 85% RH for 168 hrs ♦Test Conditions: 65 °C, 85% RH for 596 hrs

—Alloy Composition—

(Sn)

(Ag)

(Cu)

(Ni)

(Ge)

(Zn)

(Al)

(Sb)

(Fe)

(As)

(Bi)

(Cd)

(Pb)

REM.

2.8~3.2

0.3~0.7

0.04~
0.08

0.005
~
0.02

0.001 MAX

0.05 MAX

0.02 MAX

0.03 MAX

0.10 MAX

0.002 MAX

0.05 MAX

Patent No. • Japanese Patent No. 3296289 • U.S Patent No. 6179935B1. Germany Patent No. 19816671C2 (Wt%)

—Temperature Profile—

solder paste profile image

Ramp up rate(30~150 °C):	1.0~2.0 °C/sec
Pre-heating time(155~185 °C):	30~120 sec
Time period above 220 °C:	30~100 sec
Ramp up rate during reflow:	1.0~2.0 °C/sec
Peak temprature	230~250 °C
Ramp down rate during cooling:	1.0~6.0 °C/sec

—Handling and Storage Instructions—

1. Storage
(1) Refrigerate pastes at 0~10 °C to prolong shelf life; normal shelf life is 6 months from production date (sealed jars).
(2) Keep away from direct sunlight.
2. Use (Sealed)
(1) Allow pastes to reach ambient printing temperature prior to use for 3 – 4 hrs. Do not heat or raise temperature abruptly.
(2) Mix paste well with plastic spatula for 1-3 mins before use. Mixing time depends on tool type.
3. Use (Opened)
(1) At first, add 2/3 jar of solder paste onto the stencil. Do not add more than 1 jar.
(2) Add a small amount of paste at a time on the stencil according to printing speed.
(3) It is recommended to finish fresh paste within 24 hrs. To maintain paste quality, make sure not to store used paste and fresh paste in the same jar.
(4) After printing, it is suggested to place components to be mounted on the circuit board and reflow within 4 – 6 hrs.
(5) If printing process was interrupted for more than 1 hr, be sure to remove paste remnant from stencil and seal them in the jar.
(6) It is recommended to keep printing environment at 22~28 °Cand RH of 30~60%.
(7) To clean up printed circuit boards, it is suggested to use ethanol or isopropanol.

Additional information

Weight	N/A
Weight	250 gm, 500 gm
Select Type	Type 3, Type 4

PAI PF610 (SAC305+Ni+Ge) NC Solder Paste