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PAI PF609 (SAC0307) NC Solder Paste

PAI PF609 (SAC0307) NC Solder Paste

Out of stock

Lead-Free No Clean Solder Paste

PART NO: PF609

PF609 is a low-cost, lead-free halogen-free solder paste that offers the performance of tin-lead and high-silver lead-free solder pastes.

PF609  is an Sn/Ag0.3/Cu0.7 alloy with Type 3 particle size (+45 µm 1% less, -20 µm 10% less)  and Type 4 particle size (+38 µm 1% less, -20 µm 10% less) and no-clean ROL0 flux. It comes packaged in a 500-gram & 250-grams jar.

  • Pb < 1000 ppm, Cd < 20 ppm
  • High print speed: 0-120 mm/sec
  • Over 8 hours stencil life
  • Extended tack time > 12 hours
  • Excellent wettability
  • Low void

Download – Technical Data Sheet

 

SKU: PF609-1 Category:

Description

–Specification—
Item Specification Standard
Appearance Gray paste w/o visible foreign matter and clusters
Alloy composition Sn/Ag 0.3/Cu0.7 JIS-Z-3282
Melting Point 217-219 °C
Particle Size (Type 3) +45μm < 1%, —20μm < 10%
(Type 4) +38μm < 1%, —20μm < 10%		 IPC-TM-650,2.2.14
Powder Shape Spherical
Flux Content 11 ± 1.0wt% JIS-Z-3197, 8.1.2
Viscosity 200 ± 30 Pa s (25±1 C°, 10rpm,Malcom ) JIS-Z-3284, Annex 6
Flux Type ROL0 J-STD-004
—Test Content—
Test Item
 Test Result
 Test Method
Copper Plate Corrosion Test Pass JIS-Z-3197, 8.4.1
Spread Test > 75% JIS-Z-3197, 8.3.1.1
Copper Mirror Test Pass IPC-TM-650, 2.3.32
Viscosity Test(25 °C,10rpm) 200 ± 30 Pa • s JIS-Z-3284. Annex 6
Tackiness Test (gf) > 140 up (8hr) JIS-Z-3284. Annex 9
Slump Test Pass JIS-Z-3284. Annex 7, 8
Solder Ball Test Pass JIS-Z-3284. Annex 11
—Reliability Test—
S.I.R. Test ◊ > 1×109 Ω , Pass IPC-TM-650, 2.6.3.3
Electro Migration Test ♦ Pass IPC-TM-650, 2.6.14.1
◊ Test Conditions: 85 °C, 85% RH for 168 hrs ♦Test Conditions: 65 °C, 85% RH for 596 hrs
—Alloy Composition—
(Sn) (Ag) (Cu) (Ni) (Ge) (Zn) (Al) (Sb) (Fe) (As) (Bi) (Cd) (Pb)
REM. 0.2~
0.4		 0.5~
0.9		 0~0.01 0~0.01 0.001 MAX 0.001 MAX 0.05 MAX 0.02 MAX 0.03 MAX 0.10 MAX 0.002 MAX 0.05 MAX
Patent No. • Japanese Patent No. 3296289 • U.S Patent No. 6179935B1. Germany Patent No. 19816671C2 (Wt%)
—Temperature Profile—

solder paste profile image

Ramp up rate(30~150 °C): 1.0~2.0 °C/sec
Pre-heating time(155~185 °C): 30~120 sec
Time period above 220 °C: 30~100 sec
Ramp up rate during reflow: 1.0~2.0 °C/sec
Peak temprature 230~250 °C
Ramp down rate during cooling: 1.0~6.0 °C/sec
—Handling and Storage Instructions—
  • 1. Storage
  • (1) Refrigerate pastes at 0~10 °C to prolong shelf life; normal shelf life is 6 months from production date (sealed jars).
  • (2) Keep away from direct sunlight.
  • 2. Use (Sealed)
  • (1) Allow pastes to reach ambient printing temperature prior to use for 3 – 4 hrs. Do not heat or raise temperature abruptly.
  • (2) Mix paste well with plastic spatula for 1-3 mins before use. Mixing time depends on tool type.
  • 3. Use (Opened)
  • (1) At first, add 2/3 jar of solder paste onto the stencil. Do not add more than 1 jar.
  • (2) Add a small amount of paste at a time on the stencil according to printing speed.
  • (3) It is recommended to finish fresh paste within 24 hrs. To maintain paste quality, make sure not to store used paste and fresh paste in the same jar.
  • (4) After printing, it is suggested to place components to be mounted on the circuit board and reflow within 4 – 6 hrs.
  • (5) If printing process was interrupted for more than 1 hr, be sure to remove paste remnant from stencil and seal them in the jar.
  • (6) It is recommended to keep printing environment at 22~28 °Cand RH of 30~60%.
  • (7) To clean up printed circuit boards, it is suggested to use ethanol or isopropanol.

 

Additional information

Weight N/A
Weight

250 gm, 500 gm
Select Type

Type 3, Type 4

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