PAI SnAg0.3Cu0.7+Ni+Ge RoHS compliance solder wires are being formulated with high virgin raw metals processed in state-of-the-art Vaccualloy Technology that brings world class quality along. Here, oxygen interaction with alloy is nil and thus, dross formulation is reduced at PCB assembly process. Also an increased flow rate & reduced impurities found. PAI SnAg0.3Cu0.7+Ni+Ge alloy are compatible for a typical range of flux application formulas used in Electronics Industry today.
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