- High print speed (0-120 mm/sec)
- Excellent wettability
- Reflow with or without nitrogen
- Low void
- Over 8 hours stencil life
- Extended tack time > 12 hours
-
Out of stock
SH-6209 PAI tin/lead/silver no-clean solder pastes are made from a special formulation of highest purity ingredients to ensure the process consistency of today’s demanding ultra-fine-pitch challenges. Our formulation offers a wide processing window and excellent shelf life, with full wetting and clean-ability features to prolong stencil life. SH-6209 is a Sn62Ag2Pb36 alloy with Type 3 & Type 4 and no-clean ROL0 flux. It comes packaged in a 500-gram & 250-grams jar. -
Out of stock
SH-6209-4 PAI tin/lead/silver no-clean solder pastes are made from a special formulation of highest purity ingredients to ensure the process consistency of today’s demanding ultra-fine-pitch challenges. Our formulation offers a wide processing window and excellent shelf life, with full wetting and clean-ability features to prolong stencil life. SH-6209-4 is a Sn62.8 / Pb36.8 / Ag0.4 alloy with Type 3 & Type 4 and no-clean ROL0 flux. It comes packaged in a 500-gram & 250-grams jar.- High print speed (0-120 mm/sec)
- Excellent wettability
- Reflow with or without nitrogen
- Low void
- Over 8 hours stencil life
- Extended tack time > 12 hours
-
Out of stock
PAI tin/lead no-clean solder pastes are made from a special formulation of highest purity ingredients to ensure the process consistency of today's demanding ultra-fine-pitch challenges. Our formulation offers a wide processing window and excellent shelf life, with full wetting and clean-ability features to prolong stencil life. SH6309 is a Sn63/Pb37 alloy with Type 3 particle size (+45 µm 1% less, -20 µm 10% less) and no-clean ROL0 flux. It comes packaged in a 500-gram jar.- High print speed (0-120 mm/sec)
- Excellent wettability
- Reflow with or without nitrogen
- Low void
- Over 8 hours stencil life
- Extended tack time > 12 hours