Lead-Free No Clean Solder Paste
PART NO: PF606
The higher processing temperatures required for lead-free soldering make unprecedented demands on solder pastes. In addition to consistent printing and reflow requirements, there is a need for higher repeatability in high mix, high-yield lines. All these and other Pb-free challenges are met with consistency in PAI's lead-free pastes. Processable by air or nitrogen reflow, they offer the advantages of excellent wetting characteristics and long shelf life.
PF606 is an Sn/Ag3.0/Cu0.5 alloy with Type 3 particle size (+45 µm 1% less, -20 µm 10% less) and Type 4 particle size (+38 µm 1% less, -20 µm 10% less) and no-clean ROL0 flux. It comes packaged in a 500-gram & 250-grams jar.
- Pb < 1000 ppm, Cd < 20 ppm
- High print speed: 0-120 mm/sec
- Over 8 hours stencil life
- Extended tack time > 12 hours
- Excellent wettability
- Low void
